Flexible carrier for high volume electronic package fabrication
An assembly for producing partially packaged semiconductor devices is provided. In one embodiment, the assembly includes a magnetic plate; a flexible substrate disposed adjacent the magnetic plate and having two surfaces; a nonstick coating disposed on one surface of the flexible substrate thereby e...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!