Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as...

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Hauptverfasser: Ewe, Henrik, Landau, Stefan, Schiess, Klaus, Bergmann, Robert, Tatt, Alvin Wee Beng, Goh, Soon Lock, Mahler, Joachim, Plikat, Boris, Engl, Reimund
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Sprache:eng
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creator Ewe, Henrik
Landau, Stefan
Schiess, Klaus
Bergmann, Robert
Tatt, Alvin Wee Beng
Goh, Soon Lock
Mahler, Joachim
Plikat, Boris
Engl, Reimund
description A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.
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title Method for producing a power semiconductor module comprising surface-mountable flat external contacts
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