Coated package with filter profile

Coated package with filter profile

Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter l...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Keh, Kean Loo, Oon, Chin Hin, Tan, Boon Keat
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Keh, Kean Loo
Oon, Chin Hin
Tan, Boon Keat
description Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07951863</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07951863</sourcerecordid><originalsourceid>FETCH-uspatents_grants_079518633</originalsourceid><addsrcrecordid>eNrjZFByzk8sSU1RKEhMzk5MT1UozyzJUEjLzClJLVIoKMoHslJ5GFjTEnOKU3mhNDeDgptriLOHbmlxAVBvXklxfHpRIogyMLc0NbQwMzYmQgkAf5Ym1A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Coated package with filter profile</title><source>USPTO Issued Patents</source><creator>Keh, Kean Loo ; Oon, Chin Hin ; Tan, Boon Keat</creator><creatorcontrib>Keh, Kean Loo ; Oon, Chin Hin ; Tan, Boon Keat ; Avago Technologies ECBU IP (Singapore) Pte. Ltd</creatorcontrib><description>Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.</description><language>eng</language><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7951863$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,778,800,883,64024</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7951863$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Keh, Kean Loo</creatorcontrib><creatorcontrib>Oon, Chin Hin</creatorcontrib><creatorcontrib>Tan, Boon Keat</creatorcontrib><creatorcontrib>Avago Technologies ECBU IP (Singapore) Pte. Ltd</creatorcontrib><title>Coated package with filter profile</title><description>Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZFByzk8sSU1RKEhMzk5MT1UozyzJUEjLzClJLVIoKMoHslJ5GFjTEnOKU3mhNDeDgptriLOHbmlxAVBvXklxfHpRIogyMLc0NbQwMzYmQgkAf5Ym1A</recordid><startdate>20110531</startdate><enddate>20110531</enddate><creator>Keh, Kean Loo</creator><creator>Oon, Chin Hin</creator><creator>Tan, Boon Keat</creator><scope>EFH</scope></search><sort><creationdate>20110531</creationdate><title>Coated package with filter profile</title><author>Keh, Kean Loo ; Oon, Chin Hin ; Tan, Boon Keat</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_079518633</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Keh, Kean Loo</creatorcontrib><creatorcontrib>Oon, Chin Hin</creatorcontrib><creatorcontrib>Tan, Boon Keat</creatorcontrib><creatorcontrib>Avago Technologies ECBU IP (Singapore) Pte. Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Keh, Kean Loo</au><au>Oon, Chin Hin</au><au>Tan, Boon Keat</au><aucorp>Avago Technologies ECBU IP (Singapore) Pte. Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Coated package with filter profile</title><date>2011-05-31</date><risdate>2011</risdate><abstract>Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_07951863
source USPTO Issued Patents
title Coated package with filter profile
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T18%3A36%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Keh,%20Kean%20Loo&rft.aucorp=Avago%20Technologies%20ECBU%20IP%20(Singapore)%20Pte.%20Ltd&rft.date=2011-05-31&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07951863%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true