Method of improving oxide growth rate of selective oxidation processes

A method for selective oxidation of silicon containing materials in a semiconductor device is disclosed and claimed. In one aspect, a rapid thermal processing apparatus is used to selectively oxidize a substrate by in-situ steam generation at high pressure in a hydrogen rich atmosphere. Other materi...

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Bibliographische Detailangaben
Hauptverfasser: Yokota, Yoshitaka, Tam, Norman, Ramachandran, Balasubramanian, Ripley, Martin John
Format: Patent
Sprache:eng
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Zusammenfassung:A method for selective oxidation of silicon containing materials in a semiconductor device is disclosed and claimed. In one aspect, a rapid thermal processing apparatus is used to selectively oxidize a substrate by in-situ steam generation at high pressure in a hydrogen rich atmosphere. Other materials, such as metals and barrier layers, in the substrate are not oxidized.