Semiconductor die having a redistribution layer

Semiconductor die having a redistribution layer

A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes...

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Hauptverfasser: Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheeman, Takiar, Hem
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Sprache:eng
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creator Liao, Chien-Ko
Chiu, Chin-Tien
Chien, Jack Chang
Yu, Cheeman
Takiar, Hem
description A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.
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title Semiconductor die having a redistribution layer
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