Integrated circuit package system with interlock

An integrated circuit package system is provided including forming a first external interconnect and a die paddle having a slot, forming an inner terminal from a peripheral region of the die paddle, connecting an integrated circuit die and the peripheral region for ground connection, and molding thr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Dimaano, Jr, Antonio B, Marimuthu, Pandi Chelvam
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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