Semiconductor package and manufacturing method thereof and encapsulating method thereof

A semiconductor package, a manufacturing method thereof and an encapsulating method thereof are provided. The semiconductor package includes a substrate, a flip chip, a plurality of conductive parts and a sealant. The substrate has a substrate upper surface. The flip chip has an active surface and a...

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Bibliographische Detailangaben

Hauptverfasser:	Kao, Chung-Yao, Ou, Tsang-Hung
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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