Method of thinning a semiconductor substrate

A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate. A carrier substrate is thereafter attached to the laser-ablative adhesive layer. The back side of the semiconductor substrate is thinned by polishing or grinding, during which the carrier sub...

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Bibliographische Detailangaben

Hauptverfasser:	Codding, Steven R, Krywanczyk, Timothy C, Neary, Timothy E, Sprogis, Edmund J
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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