System for high efficiency solid-state light emissions and method of manufacture
In one embodiment of the invention, a bonding material is used to bond a substitute substrate to the LED, wherein the bonding material does not including gold or tin. The bonding material preferably includes gallium (Ga), such as a combination of Ga and Al or Cu. This bonding material has high therm...
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| Format: | Patent |
| Sprache: | eng |
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