Semiconductor device and manufacturing method thereof

In a semiconductor device, a region under a pad electrode with a bump can be utilized efficiently and a large amount of force is prevented from applying locally to a semiconductor substrate under the bump when the semiconductor device is mounted. A first layer metal wiring is formed on the semicondu...

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Bibliographische Detailangaben

Hauptverfasser:	Ishizeki, Hiroshi, Uehara, Masafumi
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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