Alternative method for advanced CMOS logic gate etch applications

Methods for etching, such as for fabricating a CMOS logic gate are provided herein. In some embodiments, a method of etching includes (a) providing a substrate having a first stack and a second stack disposed thereupon, the first stack comprising a high-k dielectric layer, a metal layer formed over...

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Bibliographische Detailangaben
Hauptverfasser: Gani, Nicolas, Shen, Meihua, Deshmukh, Shashank
Format: Patent
Sprache:eng
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