Metallised film for sheet contacting

An embodiment of the present invention discloses a method for contacting at least one electrical contact surface on a surface of a substrate and/or at least one component arranged on the substrate, especially a semiconductor chip. The method includes the following steps: at least one insulating film...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Weidner, Karl
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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