Coupling system and method for attaching thermal components in association with a board-mounted integrated circuit

A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupl...

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Bibliographische Detailangaben

Hauptverfasser:	Wernig, Glenn A, Tong, Ryan C, Buffington, Charles E
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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