Thermally insulating bonding pad structure for solder reflow connection

Thermally insulating bonding pad structure for solder reflow connection

A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a...

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Hauptverfasser: Hirano, Toshiki, Takahashi, Haruhide, Tsuchiya, Tatsumi
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Sprache:eng
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creator Hirano, Toshiki
Takahashi, Haruhide
Tsuchiya, Tatsumi
description A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.
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The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.</abstract><oa>free_for_read</oa></addata></record>
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title Thermally insulating bonding pad structure for solder reflow connection
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