Clipless integrated heat spreader process and materials

In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Hea...

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Bibliographische Detailangaben

Hauptverfasser:	Kostiew, George, Bahadur, Raj, Mellody, James, Vakanas, George, Arana, Leonel
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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