Stud bumps for die alignment

Stud bumps for die alignment

Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in wh...

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Hauptverfasser: Samuel, Bruno, Carpenter, Charles, Beall, John, Everman, Justin, Velsher, Benne
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Sprache:eng
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creator Samuel, Bruno
Carpenter, Charles
Beall, John
Everman, Justin
Velsher, Benne
description Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.
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A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.</abstract><oa>free_for_read</oa></addata></record>
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title Stud bumps for die alignment
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