Electronic chip module

Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-ge...

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Hauptverfasser: Lee, Tae Soo, Park, Yun Hwi
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Sprache:eng
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creator Lee, Tae Soo
Park, Yun Hwi
description Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.
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title Electronic chip module
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