Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules

Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules

A process to encapsulate electronic modules in a manner which is substantially resistant to water diffusion yet is carried out at moderate temperatures below 300° C., preferably below 150° C. is provided. The process forms a housing for electronic modules, in particular sensors, integrated circuits...

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Hauptverfasser: Leib, Jürgen, Mund, Dietrich
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creator Leib, Jürgen
Mund, Dietrich
description A process to encapsulate electronic modules in a manner which is substantially resistant to water diffusion yet is carried out at moderate temperatures below 300° C., preferably below 150° C. is provided. The process forms a housing for electronic modules, in particular sensors, integrated circuits and optoelectronic components. The process includes the steps of: providing a substrate, of which at least a first substrate side is to be encapsulated; providing a vapor-deposition glass source; arranging the first substrate side in such a manner with respect to the vapor-deposition glass source that the first substrate side can be vapor-coated; and vapor-coating the first substrate side with a glass layer.
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title Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules
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