Heat sink

Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Carlson, Brian L, Chamberlin, Bruce J, Hoffmeyer, Mark K, Katnani, Ahmad D, Kelly, Matthew S, Killinger, Gregory S, Kline, Eric V, Rothschild, Wayne J, Taylor, Jeffrey A
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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