Heat sink

Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on...

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Hauptverfasser:	Carlson, Brian L, Chamberlin, Bruce J, Hoffmeyer, Mark K, Katnani, Ahmad D, Kelly, Matthew S, Killinger, Gregory S, Kline, Eric V, Rothschild, Wayne J, Taylor, Jeffrey A
Format:	Patent
Sprache:	eng
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creator	Carlson, Brian L Chamberlin, Bruce J Hoffmeyer, Mark K Katnani, Ahmad D Kelly, Matthew S Killinger, Gregory S Kline, Eric V Rothschild, Wayne J Taylor, Jeffrey A
description	Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on the component or the attachment with a portion of the attachment disposed between the third sensor and the first and second heat sink region sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment portion, and the component with respect to heat conduction, which includes identifying the interposed heat sink portion as failing in response to a divergence between temperature inputs from the first and second heat sink region sensors. Rate-of-rise temperature readings may also be observed and compared, including to historical values.
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title	Heat sink
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