Chip level biostable interconnect for implantable medical devices

Chip level biostable interconnect for implantable medical devices

A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrate...

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creator Receveur, Rogier
description A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07853328</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07853328</sourcerecordid><originalsourceid>FETCH-uspatents_grants_078533283</originalsourceid><addsrcrecordid>eNrjZHB0zsgsUMhJLUvNUUjKzC8uSUzKSVXIzCtJLUrOz8tLTS5RSMsvUsjMLchJzINI5qamZCYn5iikpJZlJqcW8zCwpiXmFKfyQmluBgU31xBnD93S4oLEktS8kuL49KJEEGVgbmFqbGxkYUyEEgDpLzLd</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip level biostable interconnect for implantable medical devices</title><source>USPTO Issued Patents</source><creator>Receveur, Rogier</creator><creatorcontrib>Receveur, Rogier ; Medtronic, Inc</creatorcontrib><description>A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7853328$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64015</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7853328$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Receveur, Rogier</creatorcontrib><creatorcontrib>Medtronic, Inc</creatorcontrib><title>Chip level biostable interconnect for implantable medical devices</title><description>A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZHB0zsgsUMhJLUvNUUjKzC8uSUzKSVXIzCtJLUrOz8tLTS5RSMsvUsjMLchJzINI5qamZCYn5iikpJZlJqcW8zCwpiXmFKfyQmluBgU31xBnD93S4oLEktS8kuL49KJEEGVgbmFqbGxkYUyEEgDpLzLd</recordid><startdate>20101214</startdate><enddate>20101214</enddate><creator>Receveur, Rogier</creator><scope>EFH</scope></search><sort><creationdate>20101214</creationdate><title>Chip level biostable interconnect for implantable medical devices</title><author>Receveur, Rogier</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_078533283</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Receveur, Rogier</creatorcontrib><creatorcontrib>Medtronic, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Receveur, Rogier</au><aucorp>Medtronic, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip level biostable interconnect for implantable medical devices</title><date>2010-12-14</date><risdate>2010</risdate><abstract>A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.</abstract><oa>free_for_read</oa></addata></record>
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title Chip level biostable interconnect for implantable medical devices
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T05%3A20%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Receveur,%20Rogier&rft.aucorp=Medtronic,%20Inc&rft.date=2010-12-14&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07853328%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true