Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil

Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil

A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a p...

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Hauptverfasser: Ito, Yasuyuki, Matsumoto, Katsuyuki, Nukaga, Koji, Kusano, Yasuhiro, Yokomizo, Kenji, Watanabe, Shingo, Ogawara, Hiroyuki, Nomura, Katsumi
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creator Ito, Yasuyuki
Matsumoto, Katsuyuki
Nukaga, Koji
Kusano, Yasuhiro
Yokomizo, Kenji
Watanabe, Shingo
Ogawara, Hiroyuki
Nomura, Katsumi
description A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.
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Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7842397$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7842397$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ito, Yasuyuki</creatorcontrib><creatorcontrib>Matsumoto, Katsuyuki</creatorcontrib><creatorcontrib>Nukaga, Koji</creatorcontrib><creatorcontrib>Kusano, Yasuhiro</creatorcontrib><creatorcontrib>Yokomizo, Kenji</creatorcontrib><creatorcontrib>Watanabe, Shingo</creatorcontrib><creatorcontrib>Ogawara, Hiroyuki</creatorcontrib><creatorcontrib>Nomura, Katsumi</creatorcontrib><creatorcontrib>Hitachi Cable, Ltd</creatorcontrib><title>Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil</title><description>A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. 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Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.</abstract><oa>free_for_read</oa></addata></record>
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title Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
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