Semiconductor device

There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can avoid occurrences of short-circuiting of wires, an increase in chip size due to avoidance of short-circ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yamada, Yutaka, Kishida, Takeshi, Tamura, Yoshikazu, Sogawa, Yasuo, Hirofuji, Masanori
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!