Semiconductor device and method of laser-marking wafers with tape applied to its active surface

A method of laser-marking a semiconductor device involves providing a semiconductor wafer having a plurality of solder bumps formed on contact pads disposed on its active surface. The solder bumps have a diameter of about 250-280 μm. A backgrinding tape is applied over the solder bumps. The tape is...

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Bibliographische Detailangaben

Hauptverfasser:	Omandam, Glenn, Alvarez, Sheila M, Asoy, Ma. Shirley
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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