Copper electrodeposition in microelectronics

Copper electrodeposition in microelectronics

An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyether groups. The method involves supe...

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Hauptverfasser: Paneccasio, Jr, Vincent, Lin, Xuan, Figura, Paul, Hurtubise, Richard
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Sprache:eng
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creator Paneccasio, Jr, Vincent
Lin, Xuan
Figura, Paul
Hurtubise, Richard
description An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyether groups. The method involves superfilling by rapid bottom-up deposition at a superfill speed by which Cu deposition in a vertical direction from the bottoms of the features to the top openings of the features is substantially greater than Cu deposition on the side walls.
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title Copper electrodeposition in microelectronics
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