Electronic device and method for making the same

The present invention provides a method for making a vertical interconnect through a substrate. The method makes use of a sacrificial buried layer arranged in between the first side and the second side of a substrate . After having etched trenches and ′ from the first side, the sacrificial buried la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Neuilly, Francois, Chevrie, David D. R, Yon, Dominique
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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