Electronic components on trenched substrates and method of forming same

Electronic components on trenched substrates and method of forming same

A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Questad, David, Khanna, Vijayeshwar D, Muncy, Jennifer V, Sharma, Arun, Sri-Jayantha, Sri M, Valdevit, Lorenzo
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Questad, David
Khanna, Vijayeshwar D
Muncy, Jennifer V
Sharma, Arun
Sri-Jayantha, Sri M
Valdevit, Lorenzo
description A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07777301</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07777301</sourcerecordid><originalsourceid>FETCH-uspatents_grants_077773013</originalsourceid><addsrcrecordid>eNqNjMENwjAMRXPhgIAdvABSUQ8MgEoZoHdkEqet1NiV7e7fIDEA7_Iu7_9j6LuFoqvwHCFKWYWJ3UAYXInjRAls-5grOhkgJyjkkySQDFm0zDyCYaFzOGRcjC4_nwI8u-Hxum621mn9fI-KXzX3Stvc2j-SHV-GNSU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic components on trenched substrates and method of forming same</title><source>USPTO Issued Patents</source><creator>Questad, David ; Khanna, Vijayeshwar D ; Muncy, Jennifer V ; Sharma, Arun ; Sri-Jayantha, Sri M ; Valdevit, Lorenzo</creator><creatorcontrib>Questad, David ; Khanna, Vijayeshwar D ; Muncy, Jennifer V ; Sharma, Arun ; Sri-Jayantha, Sri M ; Valdevit, Lorenzo ; International Business Machines Corporation</creatorcontrib><description>A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7777301$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64015</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7777301$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Questad, David</creatorcontrib><creatorcontrib>Khanna, Vijayeshwar D</creatorcontrib><creatorcontrib>Muncy, Jennifer V</creatorcontrib><creatorcontrib>Sharma, Arun</creatorcontrib><creatorcontrib>Sri-Jayantha, Sri M</creatorcontrib><creatorcontrib>Valdevit, Lorenzo</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Electronic components on trenched substrates and method of forming same</title><description>A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNjMENwjAMRXPhgIAdvABSUQ8MgEoZoHdkEqet1NiV7e7fIDEA7_Iu7_9j6LuFoqvwHCFKWYWJ3UAYXInjRAls-5grOhkgJyjkkySQDFm0zDyCYaFzOGRcjC4_nwI8u-Hxum621mn9fI-KXzX3Stvc2j-SHV-GNSU</recordid><startdate>20100817</startdate><enddate>20100817</enddate><creator>Questad, David</creator><creator>Khanna, Vijayeshwar D</creator><creator>Muncy, Jennifer V</creator><creator>Sharma, Arun</creator><creator>Sri-Jayantha, Sri M</creator><creator>Valdevit, Lorenzo</creator><scope>EFH</scope></search><sort><creationdate>20100817</creationdate><title>Electronic components on trenched substrates and method of forming same</title><author>Questad, David ; Khanna, Vijayeshwar D ; Muncy, Jennifer V ; Sharma, Arun ; Sri-Jayantha, Sri M ; Valdevit, Lorenzo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_077773013</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Questad, David</creatorcontrib><creatorcontrib>Khanna, Vijayeshwar D</creatorcontrib><creatorcontrib>Muncy, Jennifer V</creatorcontrib><creatorcontrib>Sharma, Arun</creatorcontrib><creatorcontrib>Sri-Jayantha, Sri M</creatorcontrib><creatorcontrib>Valdevit, Lorenzo</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Questad, David</au><au>Khanna, Vijayeshwar D</au><au>Muncy, Jennifer V</au><au>Sharma, Arun</au><au>Sri-Jayantha, Sri M</au><au>Valdevit, Lorenzo</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic components on trenched substrates and method of forming same</title><date>2010-08-17</date><risdate>2010</risdate><abstract>A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_07777301
source USPTO Issued Patents
title Electronic components on trenched substrates and method of forming same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T00%3A26%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Questad,%20David&rft.aucorp=International%20Business%20Machines%20Corporation&rft.date=2010-08-17&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07777301%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true