Stacked package structure for reducing package volume of an acoustic micro-sensor

A stacked package structure utilizes flip-chip technology to stack an acoustic micro-sensor on an integrated circuit (IC) device having a recess as a back chamber and cover the acoustic micro-sensor using a glass substrate or a planar substrate with an aperture. With the use of the stacked package s...

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Bibliographische Detailangaben

Hauptverfasser:	Chien, Hsin-Tang, Hsiao, Chieh-Ling, Wang, Chin-Hung
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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