Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same

Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same

A wafer with an orientation notch being cut in a portion of its circumference, the wafer includes: a reinforcing flange formed upright at periphery; and a thin section surrounded by the reinforcing flange and having a smaller thickness than the reinforcing flange. The reinforcing flange includes a c...

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Hauptverfasser: Sugawara, Yasuharu, Kobayashi, Motoshige
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creator Sugawara, Yasuharu
Kobayashi, Motoshige
description A wafer with an orientation notch being cut in a portion of its circumference, the wafer includes: a reinforcing flange formed upright at periphery; and a thin section surrounded by the reinforcing flange and having a smaller thickness than the reinforcing flange. The reinforcing flange includes a circumferential portion formed upright along the circumference and a notch portion formed upright near the orientation notch, and a width of the circumferential portion as viewed parallel to a major surface of the wafer is smaller than a depth of the orientation notch as viewed parallel to the major surface.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07737531</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07737531</sourcerecordid><originalsourceid>FETCH-uspatents_grants_077375313</originalsourceid><addsrcrecordid>eNqNjMsJQjEQRbNxIWoP04CgBEkBoliA4FKGZPKBZF6YJAu79wUsQLhwOHC4WxVf6Ekgsc3DJQ6AIJTYL2Kn-YwcCFYt5GBUSSF2wHVQSVKNJB9AdlCox8XNEAry8Gj7kPnQI0HDQnu18ZgbHX7cKbjfntfHcbSKnbi3dxCcOBmjzUWf9R_JF5bhQRk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same</title><source>USPTO Issued Patents</source><creator>Sugawara, Yasuharu ; Kobayashi, Motoshige</creator><creatorcontrib>Sugawara, Yasuharu ; Kobayashi, Motoshige ; Kabushiki Kaisha Toshiba</creatorcontrib><description>A wafer with an orientation notch being cut in a portion of its circumference, the wafer includes: a reinforcing flange formed upright at periphery; and a thin section surrounded by the reinforcing flange and having a smaller thickness than the reinforcing flange. The reinforcing flange includes a circumferential portion formed upright along the circumference and a notch portion formed upright near the orientation notch, and a width of the circumferential portion as viewed parallel to a major surface of the wafer is smaller than a depth of the orientation notch as viewed parallel to the major surface.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7737531$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7737531$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Sugawara, Yasuharu</creatorcontrib><creatorcontrib>Kobayashi, Motoshige</creatorcontrib><creatorcontrib>Kabushiki Kaisha Toshiba</creatorcontrib><title>Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same</title><description>A wafer with an orientation notch being cut in a portion of its circumference, the wafer includes: a reinforcing flange formed upright at periphery; and a thin section surrounded by the reinforcing flange and having a smaller thickness than the reinforcing flange. The reinforcing flange includes a circumferential portion formed upright along the circumference and a notch portion formed upright near the orientation notch, and a width of the circumferential portion as viewed parallel to a major surface of the wafer is smaller than a depth of the orientation notch as viewed parallel to the major surface.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNjMsJQjEQRbNxIWoP04CgBEkBoliA4FKGZPKBZF6YJAu79wUsQLhwOHC4WxVf6Ekgsc3DJQ6AIJTYL2Kn-YwcCFYt5GBUSSF2wHVQSVKNJB9AdlCox8XNEAry8Gj7kPnQI0HDQnu18ZgbHX7cKbjfntfHcbSKnbi3dxCcOBmjzUWf9R_JF5bhQRk</recordid><startdate>20100615</startdate><enddate>20100615</enddate><creator>Sugawara, Yasuharu</creator><creator>Kobayashi, Motoshige</creator><scope>EFH</scope></search><sort><creationdate>20100615</creationdate><title>Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same</title><author>Sugawara, Yasuharu ; Kobayashi, Motoshige</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_077375313</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Sugawara, Yasuharu</creatorcontrib><creatorcontrib>Kobayashi, Motoshige</creatorcontrib><creatorcontrib>Kabushiki Kaisha Toshiba</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sugawara, Yasuharu</au><au>Kobayashi, Motoshige</au><aucorp>Kabushiki Kaisha Toshiba</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same</title><date>2010-06-15</date><risdate>2010</risdate><abstract>A wafer with an orientation notch being cut in a portion of its circumference, the wafer includes: a reinforcing flange formed upright at periphery; and a thin section surrounded by the reinforcing flange and having a smaller thickness than the reinforcing flange. The reinforcing flange includes a circumferential portion formed upright along the circumference and a notch portion formed upright near the orientation notch, and a width of the circumferential portion as viewed parallel to a major surface of the wafer is smaller than a depth of the orientation notch as viewed parallel to the major surface.</abstract><oa>free_for_read</oa></addata></record>
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title Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T13%3A12%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Sugawara,%20Yasuharu&rft.aucorp=Kabushiki%20Kaisha%20Toshiba&rft.date=2010-06-15&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07737531%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true