Connection structure of flexible substrate
In the case of connecting a flexible substrate to a counterpart substrate by soldering, the area of a dead space on the counterpart substrate due to being covered with the flexible substrate is reduced to reduce the outside dimension of the counterpart substrate. Solder lands and on the flexible sub...
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| creator | Nishidate, Tetsuo |
| description | In the case of connecting a flexible substrate to a counterpart substrate by soldering, the area of a dead space on the counterpart substrate due to being covered with the flexible substrate is reduced to reduce the outside dimension of the counterpart substrate. Solder lands and on the flexible substrate are soldered to solder lands and on the counterpart substrate . The flexible substrate is divided into two branching pieces and by an incision or a slit formed in such a manner as to extend from an intermediate part in the arrangement direction R of circuit patterns to the leading end of the flexible substrate. The space between the solder lands and on the respective pieces and is made equal to the space between the two spaced-apart solder lands and on the counterpart substrate by placing the pieces and formed by dividing the flexible substrate on one another. |
| format | Patent |
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Solder lands and on the flexible substrate are soldered to solder lands and on the counterpart substrate . The flexible substrate is divided into two branching pieces and by an incision or a slit formed in such a manner as to extend from an intermediate part in the arrangement direction R of circuit patterns to the leading end of the flexible substrate. 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Solder lands and on the flexible substrate are soldered to solder lands and on the counterpart substrate . The flexible substrate is divided into two branching pieces and by an incision or a slit formed in such a manner as to extend from an intermediate part in the arrangement direction R of circuit patterns to the leading end of the flexible substrate. 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Solder lands and on the flexible substrate are soldered to solder lands and on the counterpart substrate . The flexible substrate is divided into two branching pieces and by an incision or a slit formed in such a manner as to extend from an intermediate part in the arrangement direction R of circuit patterns to the leading end of the flexible substrate. The space between the solder lands and on the respective pieces and is made equal to the space between the two spaced-apart solder lands and on the counterpart substrate by placing the pieces and formed by dividing the flexible substrate on one another.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Connection structure of flexible substrate |
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