Method of attaching printhead integrated circuits to an ink manifold using adhesive film

A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and sec...

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Hauptverfasser:	Keshishian, Sarkis Minas, Williams, Susan, Papworth, Paul Andrew, Silverbrook, Kia
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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