Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout

Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout

One embodiment of the present invention determines the effect of placing an assist feature at a location in a layout. During operation, the system receives a first value which was pre-computed by convolving a model with a layout at an evaluation point, wherein the model models semiconductor manufact...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Li, Jianliang, Yan, Qiliang, Melvin, III, Lawrence S, Barnes, Levi D, Biswas, Abani M
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Li, Jianliang
Yan, Qiliang
Melvin, III, Lawrence S
Barnes, Levi D
Biswas, Abani M
description One embodiment of the present invention determines the effect of placing an assist feature at a location in a layout. During operation, the system receives a first value which was pre-computed by convolving a model with a layout at an evaluation point, wherein the model models semiconductor manufacturing processes. Next, the system determines a second value by convolving the model with an assist feature, which is assumed to be located at a first location which is in proximity to the evaluation point. The system then determines the effect of placing an assist feature using the first value and the second value. An embodiment of the present invention can be used to determine a substantially optimal location for placing an assist feature in a layout.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07721246</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07721246</sourcerecordid><originalsourceid>FETCH-uspatents_grants_077212463</originalsourceid><addsrcrecordid>eNqNi0EKwjAURLtxIeod5gKCVrEHEMWNO_fySX_aYPyJyc-it7cBD-BieMxjZtnInXUMPUjmxEiJtGTYkPApzrz8hJ6V09uJkwE6MthaNopgET2ZaklAObussDzfE4MUBB8MqQsCJ7XRFIqum4Uln3nz46rB9fI437YlR1IWzc8hUcWu69p9ezwd_ph8AR_TQtk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout</title><source>USPTO Issued Patents</source><creator>Li, Jianliang ; Yan, Qiliang ; Melvin, III, Lawrence S ; Barnes, Levi D ; Biswas, Abani M</creator><creatorcontrib>Li, Jianliang ; Yan, Qiliang ; Melvin, III, Lawrence S ; Barnes, Levi D ; Biswas, Abani M ; Synopsys, Inc</creatorcontrib><description>One embodiment of the present invention determines the effect of placing an assist feature at a location in a layout. During operation, the system receives a first value which was pre-computed by convolving a model with a layout at an evaluation point, wherein the model models semiconductor manufacturing processes. Next, the system determines a second value by convolving the model with an assist feature, which is assumed to be located at a first location which is in proximity to the evaluation point. The system then determines the effect of placing an assist feature using the first value and the second value. An embodiment of the present invention can be used to determine a substantially optimal location for placing an assist feature in a layout.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7721246$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64016</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7721246$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Li, Jianliang</creatorcontrib><creatorcontrib>Yan, Qiliang</creatorcontrib><creatorcontrib>Melvin, III, Lawrence S</creatorcontrib><creatorcontrib>Barnes, Levi D</creatorcontrib><creatorcontrib>Biswas, Abani M</creatorcontrib><creatorcontrib>Synopsys, Inc</creatorcontrib><title>Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout</title><description>One embodiment of the present invention determines the effect of placing an assist feature at a location in a layout. During operation, the system receives a first value which was pre-computed by convolving a model with a layout at an evaluation point, wherein the model models semiconductor manufacturing processes. Next, the system determines a second value by convolving the model with an assist feature, which is assumed to be located at a first location which is in proximity to the evaluation point. The system then determines the effect of placing an assist feature using the first value and the second value. An embodiment of the present invention can be used to determine a substantially optimal location for placing an assist feature in a layout.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNi0EKwjAURLtxIeod5gKCVrEHEMWNO_fySX_aYPyJyc-it7cBD-BieMxjZtnInXUMPUjmxEiJtGTYkPApzrz8hJ6V09uJkwE6MthaNopgET2ZaklAObussDzfE4MUBB8MqQsCJ7XRFIqum4Uln3nz46rB9fI437YlR1IWzc8hUcWu69p9ezwd_ph8AR_TQtk</recordid><startdate>20100518</startdate><enddate>20100518</enddate><creator>Li, Jianliang</creator><creator>Yan, Qiliang</creator><creator>Melvin, III, Lawrence S</creator><creator>Barnes, Levi D</creator><creator>Biswas, Abani M</creator><scope>EFH</scope></search><sort><creationdate>20100518</creationdate><title>Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout</title><author>Li, Jianliang ; Yan, Qiliang ; Melvin, III, Lawrence S ; Barnes, Levi D ; Biswas, Abani M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_077212463</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Li, Jianliang</creatorcontrib><creatorcontrib>Yan, Qiliang</creatorcontrib><creatorcontrib>Melvin, III, Lawrence S</creatorcontrib><creatorcontrib>Barnes, Levi D</creatorcontrib><creatorcontrib>Biswas, Abani M</creatorcontrib><creatorcontrib>Synopsys, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Li, Jianliang</au><au>Yan, Qiliang</au><au>Melvin, III, Lawrence S</au><au>Barnes, Levi D</au><au>Biswas, Abani M</au><aucorp>Synopsys, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout</title><date>2010-05-18</date><risdate>2010</risdate><abstract>One embodiment of the present invention determines the effect of placing an assist feature at a location in a layout. During operation, the system receives a first value which was pre-computed by convolving a model with a layout at an evaluation point, wherein the model models semiconductor manufacturing processes. Next, the system determines a second value by convolving the model with an assist feature, which is assumed to be located at a first location which is in proximity to the evaluation point. The system then determines the effect of placing an assist feature using the first value and the second value. An embodiment of the present invention can be used to determine a substantially optimal location for placing an assist feature in a layout.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_07721246
source USPTO Issued Patents
title Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T11%3A00%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Li,%20Jianliang&rft.aucorp=Synopsys,%20Inc&rft.date=2010-05-18&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07721246%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true