Method for packaging circuits and packaged circuits

A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of t...

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Bibliographische Detailangaben

Hauptverfasser:	Chia, Yong Poo, Waf, Low Siu, Boon, Suan Jeung, Koon, Eng Meow, Chua, Swee Kwang
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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