Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces

Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements projecting from the first surface....

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Bibliographische Detailangaben

1. Verfasser:	Ramarajan, Suresh
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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