Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yajima, Hiromi, Imoto, Yukio, Kodama, Shoichi, Aoki, Riichiro, Omichi, Takashi, Nishi, Toyomi, Togawa, Tetsuji
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Yajima, Hiromi
Imoto, Yukio
Kodama, Shoichi
Aoki, Riichiro
Omichi, Takashi
Nishi, Toyomi
Togawa, Tetsuji
description A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07708618</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07708618</sourcerecordid><originalsourceid>FETCH-uspatents_grants_077086183</originalsourceid><addsrcrecordid>eNrjZIjwTS3JyE9RSMwD4oKCxKLEktJihbT8IoWUokrdzDwdMJ1fWqJQkJ-TWZyRmZcOVlueCGHnpykkKhSn5mYm5-ellCaXgDSmlmUmp_IwsKYl5hSn8kJpbgYFN9cQZw_d0uKCxJLUvJLi-PSiRBBlYG5uYGFmaGFMhBIAEsg6zA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device</title><source>USPTO Issued Patents</source><creator>Yajima, Hiromi ; Imoto, Yukio ; Kodama, Shoichi ; Aoki, Riichiro ; Omichi, Takashi ; Nishi, Toyomi ; Togawa, Tetsuji</creator><creatorcontrib>Yajima, Hiromi ; Imoto, Yukio ; Kodama, Shoichi ; Aoki, Riichiro ; Omichi, Takashi ; Nishi, Toyomi ; Togawa, Tetsuji ; Kabushiki Kaisha Toshiba ; Ebara Corporation</creatorcontrib><description>A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7708618$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64015</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7708618$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yajima, Hiromi</creatorcontrib><creatorcontrib>Imoto, Yukio</creatorcontrib><creatorcontrib>Kodama, Shoichi</creatorcontrib><creatorcontrib>Aoki, Riichiro</creatorcontrib><creatorcontrib>Omichi, Takashi</creatorcontrib><creatorcontrib>Nishi, Toyomi</creatorcontrib><creatorcontrib>Togawa, Tetsuji</creatorcontrib><creatorcontrib>Kabushiki Kaisha Toshiba</creatorcontrib><creatorcontrib>Ebara Corporation</creatorcontrib><title>Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device</title><description>A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZIjwTS3JyE9RSMwD4oKCxKLEktJihbT8IoWUokrdzDwdMJ1fWqJQkJ-TWZyRmZcOVlueCGHnpykkKhSn5mYm5-ellCaXgDSmlmUmp_IwsKYl5hSn8kJpbgYFN9cQZw_d0uKCxJLUvJLi-PSiRBBlYG5uYGFmaGFMhBIAEsg6zA</recordid><startdate>20100504</startdate><enddate>20100504</enddate><creator>Yajima, Hiromi</creator><creator>Imoto, Yukio</creator><creator>Kodama, Shoichi</creator><creator>Aoki, Riichiro</creator><creator>Omichi, Takashi</creator><creator>Nishi, Toyomi</creator><creator>Togawa, Tetsuji</creator><scope>EFH</scope></search><sort><creationdate>20100504</creationdate><title>Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device</title><author>Yajima, Hiromi ; Imoto, Yukio ; Kodama, Shoichi ; Aoki, Riichiro ; Omichi, Takashi ; Nishi, Toyomi ; Togawa, Tetsuji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_077086183</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Yajima, Hiromi</creatorcontrib><creatorcontrib>Imoto, Yukio</creatorcontrib><creatorcontrib>Kodama, Shoichi</creatorcontrib><creatorcontrib>Aoki, Riichiro</creatorcontrib><creatorcontrib>Omichi, Takashi</creatorcontrib><creatorcontrib>Nishi, Toyomi</creatorcontrib><creatorcontrib>Togawa, Tetsuji</creatorcontrib><creatorcontrib>Kabushiki Kaisha Toshiba</creatorcontrib><creatorcontrib>Ebara Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yajima, Hiromi</au><au>Imoto, Yukio</au><au>Kodama, Shoichi</au><au>Aoki, Riichiro</au><au>Omichi, Takashi</au><au>Nishi, Toyomi</au><au>Togawa, Tetsuji</au><aucorp>Kabushiki Kaisha Toshiba</aucorp><aucorp>Ebara Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device</title><date>2010-05-04</date><risdate>2010</risdate><abstract>A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_07708618
source USPTO Issued Patents
title Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T13%3A41%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Yajima,%20Hiromi&rft.aucorp=Kabushiki%20Kaisha%20Toshiba&rft.date=2010-05-04&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07708618%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true