Integrated circuit package

Integrated circuit package

Integrated circuit (IC) packages are described. Each IC package includes a die having an exposed metallic layer deposited on its back surface. Solder joints are arranged to physically and electrically connect I/O pads on the active surface of the die with associated leads. A molding material encapsu...

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Hauptverfasser: Bayan, Jaime A, Poddar, Anindya
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Sprache:eng
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creator Bayan, Jaime A
Poddar, Anindya
description Integrated circuit (IC) packages are described. Each IC package includes a die having an exposed metallic layer deposited on its back surface. Solder joints are arranged to physically and electrically connect I/O pads on the active surface of the die with associated leads. A molding material encapsulates portions of the die, leadframe and solder joint connections while leaving the metallic layer exposed and uncovered by molding material.
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title Integrated circuit package
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