Side-view optical diode package and fabricating process thereof

A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The h...

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Bibliographische Detailangaben

Hauptverfasser:	Chen, Chih-Ming, Hwang, Deng-Huei, Cheng, Ching-Chi, Wen, An-Nong
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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