Laser facet passivation

Methods of preparing front and back facets of a diode laser include controlling an atmosphere within a first chamber, such that an oxygen content and a water vapor content are controlled to within predetermined levels and cleaving the diode laser from a wafer within the controlled atmosphere of the...

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Bibliographische Detailangaben

Hauptverfasser:	Charache, Greg, Hostetler, John, Jiang, Ching-Long, Menna, Raymond J, Radionova, Radosveta, Roff, Robert W, Schlüter, Holger
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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