Electronic assembly remanufacturing system and method

A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a...

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Hauptverfasser: Gottshall, Paul C, Santillan Guerrero, Ernesto Nicanor
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Sprache:eng
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creator Gottshall, Paul C
Santillan Guerrero, Ernesto Nicanor
description A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07681778</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07681778</sourcerecordid><originalsourceid>FETCH-uspatents_grants_076817783</originalsourceid><addsrcrecordid>eNrjZDB1zUlNLinKz8tMVkgsLk7NTcqpVChKzU3MK01LTC4pLcrMS1coriwuSc1VSMxLUchNLcnIT-FhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwNzMwtDc3MKYCCUAhtwuzg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic assembly remanufacturing system and method</title><source>USPTO Issued Patents</source><creator>Gottshall, Paul C ; Santillan Guerrero, Ernesto Nicanor</creator><creatorcontrib>Gottshall, Paul C ; Santillan Guerrero, Ernesto Nicanor ; Caterpillar Inc</creatorcontrib><description>A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7681778$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64016</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7681778$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gottshall, Paul C</creatorcontrib><creatorcontrib>Santillan Guerrero, Ernesto Nicanor</creatorcontrib><creatorcontrib>Caterpillar Inc</creatorcontrib><title>Electronic assembly remanufacturing system and method</title><description>A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZDB1zUlNLinKz8tMVkgsLk7NTcqpVChKzU3MK01LTC4pLcrMS1coriwuSc1VSMxLUchNLcnIT-FhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwNzMwtDc3MKYCCUAhtwuzg</recordid><startdate>20100323</startdate><enddate>20100323</enddate><creator>Gottshall, Paul C</creator><creator>Santillan Guerrero, Ernesto Nicanor</creator><scope>EFH</scope></search><sort><creationdate>20100323</creationdate><title>Electronic assembly remanufacturing system and method</title><author>Gottshall, Paul C ; Santillan Guerrero, Ernesto Nicanor</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_076817783</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Gottshall, Paul C</creatorcontrib><creatorcontrib>Santillan Guerrero, Ernesto Nicanor</creatorcontrib><creatorcontrib>Caterpillar Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Gottshall, Paul C</au><au>Santillan Guerrero, Ernesto Nicanor</au><aucorp>Caterpillar Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic assembly remanufacturing system and method</title><date>2010-03-23</date><risdate>2010</risdate><abstract>A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.</abstract><oa>free_for_read</oa></addata></record>
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title Electronic assembly remanufacturing system and method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T23%3A55%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Gottshall,%20Paul%20C&rft.aucorp=Caterpillar%20Inc&rft.date=2010-03-23&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07681778%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true