Light emitting diode display device comprising a high temperature resistant overlay

Light emitting diode display device comprising a high temperature resistant overlay

A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An...

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Hauptverfasser: Fung, Elizabeth Ching Ling, Ng, Kee Yean, Yeoh, Hong Hust
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Sprache:eng
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creator Fung, Elizabeth Ching Ling
Ng, Kee Yean
Yeoh, Hong Hust
description A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07675231</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07675231</sourcerecordid><originalsourceid>FETCH-uspatents_grants_076752313</originalsourceid><addsrcrecordid>eNqNiz0KwkAQRrexEPUOcwFBDZoDiGJhp70M2XEzkP1hZhLw9m7AA9h8r_jeW7rHnUNvQJHNOAXwnD3V1TLgBzxN3BF0ORZhnX-EvgZgFAsJ2igEQspqmAzyRFKztVu8cVDa_LhycL08z7ftqAWNkukrCM7Ytaf2eGj2zR_KF1IOOfM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting diode display device comprising a high temperature resistant overlay</title><source>USPTO Issued Patents</source><creator>Fung, Elizabeth Ching Ling ; Ng, Kee Yean ; Yeoh, Hong Hust</creator><creatorcontrib>Fung, Elizabeth Ching Ling ; Ng, Kee Yean ; Yeoh, Hong Hust</creatorcontrib><description>A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.</description><language>eng</language><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7675231$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7675231$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Fung, Elizabeth Ching Ling</creatorcontrib><creatorcontrib>Ng, Kee Yean</creatorcontrib><creatorcontrib>Yeoh, Hong Hust</creatorcontrib><title>Light emitting diode display device comprising a high temperature resistant overlay</title><description>A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNiz0KwkAQRrexEPUOcwFBDZoDiGJhp70M2XEzkP1hZhLw9m7AA9h8r_jeW7rHnUNvQJHNOAXwnD3V1TLgBzxN3BF0ORZhnX-EvgZgFAsJ2igEQspqmAzyRFKztVu8cVDa_LhycL08z7ftqAWNkukrCM7Ytaf2eGj2zR_KF1IOOfM</recordid><startdate>20100309</startdate><enddate>20100309</enddate><creator>Fung, Elizabeth Ching Ling</creator><creator>Ng, Kee Yean</creator><creator>Yeoh, Hong Hust</creator><scope>EFH</scope></search><sort><creationdate>20100309</creationdate><title>Light emitting diode display device comprising a high temperature resistant overlay</title><author>Fung, Elizabeth Ching Ling ; Ng, Kee Yean ; Yeoh, Hong Hust</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_076752313</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Fung, Elizabeth Ching Ling</creatorcontrib><creatorcontrib>Ng, Kee Yean</creatorcontrib><creatorcontrib>Yeoh, Hong Hust</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fung, Elizabeth Ching Ling</au><au>Ng, Kee Yean</au><au>Yeoh, Hong Hust</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting diode display device comprising a high temperature resistant overlay</title><date>2010-03-09</date><risdate>2010</risdate><abstract>A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.</abstract><oa>free_for_read</oa></addata></record>
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title Light emitting diode display device comprising a high temperature resistant overlay
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T04%3A18%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Fung,%20Elizabeth%20Ching%20Ling&rft.date=2010-03-09&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07675231%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true