Method and structure for connecting, stacking, and cooling chips on a flexible carrier

A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary...

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Bibliographische Detailangaben

Hauptverfasser:	Bartley, Gerald Keith, Becker, Darryl John, Dahlen, Paul Eric, Germann, Philip Raymond, Maki, Andrew Benson, Maxson, Mark Owen
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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