Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another

A chip-scale or wafer-level-package, having passivation layers on substantially all surfaces thereof to form a hermetically sealed-package, is provided. The package may be formed by disposing a first passivation layer on the passive or backside surface of a semiconductor wafer. The semiconductor waf...

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1. Verfasser:	Doan, Trung T
Format:	Patent
Sprache:	eng
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