Method of making a semiconductor package and method of making a semiconductor device

The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wu, Yen-Yi, Sung, Wei-Yueh, Chang Chien, Pao-Huei, Chu, Chi-Chih, Lee, Cheng-Yin, Weng, Gwo-Liang
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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