Semiconductor device

A semiconductor device with a packaging circuit portion connected to a semiconductor chip therein. The semiconductor chip includes a plurality of pad electrodes, and the packaging circuit portion includes wiring connected to the pad electrodes on the semiconductor chip, mounting terminals, and a fir...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Itano, Noriyuki, Mitsumoto, Kinya
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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