Method for manufacturing electronic component-mounted board

A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component (A), with a solder bump electrode containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating...

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Bibliographische Detailangaben

Hauptverfasser:	Abe, Tomoyuki, Yamagishi, Yasuo
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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