Method of depositing a sculptured copper seed layer

A method of applying a sculptured copper seed layer on a semiconductor feature surface using ion deposition sputtering. A first protective layer of material is deposited on a substrate surface using traditional sputtering or ion deposition sputtering, in combination with sufficiently low substrate b...

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Bibliographische Detailangaben

Hauptverfasser:	Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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