Electronic carrier board applicable to surface mounted technology (SMT)

An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tsai, Fang-Lin, Tsai, Ho-Yi, Tseng, Wen-Tsung, Huang, Chih-Ming
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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