Tape removal in semiconductor structure fabrication

A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer comprises an adhesive material. The method includes the step of submerging the tape in a liquid chemical c...

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Bibliographische Detailangaben

Hauptverfasser:	Codding, Steven R, Krywanczyk, Timothy C, Perrotte, Steven G, Ritter, Jason P
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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