Semiconductor device and method for manufacturing the same
A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base substrate; forming a eutectic alloy by contacting the wiring with the electrode and by heating and pressurizing...
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| creator | Urushido, Tatsuhiro |
| description | A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base substrate; forming a eutectic alloy by contacting the wiring with the electrode and by heating and pressurizing, and; forming the eutectic alloy so as a part of the eutectic alloy enters between the wiring and the base substrate. |
| format | Patent |
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| language | eng |
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| source | USPTO Issued Patents |
| title | Semiconductor device and method for manufacturing the same |
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