Wafer processing apparatus
A wafer processing apparatus, for processing a wafer with a surface protective film attached on the front surface on which at least one circuit pattern is formed, includes a dicing tape application unit for attaching a dicing tape on a frame and the wafer, a surplus dicing tape take-up unit for taki...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A wafer processing apparatus, for processing a wafer with a surface protective film attached on the front surface on which at least one circuit pattern is formed, includes a dicing tape application unit for attaching a dicing tape on a frame and the wafer, a surplus dicing tape take-up unit for taking up the surplus part of the dicing tape attached on the frame and the wafer and a surface protective film peeling unit for peeling the surface protective film from the wafer using a peeling tape. At least one of the dicing tape application unit, the surplus dicing tape take-up unit and the surface protective film peeling unit is slidably arranged in that order on common rails. As a result, tape can be loaded and the maintenance work on each unit can be carried out easily. |
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